{"id":1852,"date":"2022-09-20T12:05:00","date_gmt":"2022-09-20T10:05:00","guid":{"rendered":"http:\/\/test.pcbinvestigator.de\/en\/?p=1852"},"modified":"2022-10-14T11:39:06","modified_gmt":"2022-10-14T09:39:06","slug":"the-latest-version-v13-of-our-pcb-investigator-software-is-now-available-for-you","status":"publish","type":"post","link":"https:\/\/www.sts-development.biz\/en\/2022\/09\/20\/the-latest-version-v13-of-our-pcb-investigator-software-is-now-available-for-you\/","title":{"rendered":"The latest version V13 of our PCB-Investigator software is now available for you!"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\">As usual, this year&#8217;s release also offers you a wide range of innovations, upgrades and improvements. And because we always focus on you as a customer, all innovations and modifications are<strong> geared to your individual wishes<\/strong>..<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For us, customer-oriented software development always means maintaining the <strong>simplest possible usability<\/strong>, so that you can incorporate all new features into your everyday work as quickly as possible!<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">What the V13 can offer you:<\/p>\n\n\n\n<ol class=\"wp-block-list\"><li><strong>PCB-Investigator<\/strong><ul><li>New handling of licenses<\/li><li>New SOD license server<\/li><li>Minor improvements and bug fixes<\/li><li>Support of MPN packages (bodies of real components can be overlaid)<\/li><li>API extensions<\/li><li>Polarity marker support<\/li><li>Improved &#8220;Bottom View&#8221;<\/li><\/ul><\/li><li><strong>PCB-Investigator Physics<\/strong><ul><li>Copy\/Paste in Chronology Timeline<\/li><li>Possibility to ignore individual pins<\/li><\/ul><\/li><li><strong>PCB-Investigator 365 Cloud<\/strong><ul><li>Minor improvements and bug fixes<\/li><li>New features:<ul><li>Master Check-In<\/li><li>Un-Freeze<\/li><li>Copy design<\/li><li>Delete design<\/li><li>Design link open<\/li><li>Notification settings<\/li><\/ul><\/li><li>Possibility of login via Microsoft Azure<\/li><\/ul><\/li><li><strong>Importer\/Exporter<\/strong><ul><li>CamCAD CCZ Importer<ul><li>New<\/li><\/ul><\/li><li>Fabmaster Importer<ul><li>New<\/li><\/ul><\/li><li>GDSII Importer<ul><li>New<\/li><\/ul><\/li><li>IPC 2581 Exporter<ul><li>New<\/li><\/ul><\/li><li>MPN Package Importer<ul><li>New<\/li><li>Support for Mycronic libraries<\/li><li>Support of ASM Siplace OIB interface<\/li><\/ul><\/li><li>CNC Exporter (Excellon, Sieb&amp;Meyer)<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><li>Component Attribute Importer<ul><li>Variants handling<\/li><\/ul><\/li><li>DPF Importer<ul><li>Bug fixes<\/li><\/ul><\/li><li>DXF Importer<ul><li>Bug fixes<\/li><li>Dimension support<\/li><\/ul><\/li><li>EAGLE Importer<ul><li>Bug fixes<\/li><li>Support of &#8220;polygonshapes&#8221;<\/li><\/ul><\/li><li>GenCAD Importer\/Exporter<ul><li>Bug fixes<\/li><\/ul><\/li><li>IDF Importer\/Exporter<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><li>IPC 2581 Importer<ul><li>Minor improvements and bug fixes<\/li><li>MPN Packages Import<\/li><\/ul><\/li><li>IPC356 Importer\/Exporter<ul><li>Completely revised<\/li><li>Support of panels, adjacency entries, board outlines, traces<\/li><\/ul><\/li><li>ODB++ Importer\/Exporter<ul><li>Minor improvements and bug fixes<\/li><li>Improved netlist generation<\/li><li>Start\/end correction for drilling positions (matrix)<\/li><\/ul><\/li><li>PDF Importer<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><li>QD Exporter<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><li>Step file Exporter<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><\/ul><\/li><li><strong>Analysis<\/strong><ul><li>Possibility to save\/load the last analysis result and mark individual errors as &#8216;critical&#8217; at\u2026<ul><li>AOI Analysis<\/li><li>Bare Board Analysis (DRC) (has already existed)<\/li><li>Component Analysis<\/li><li>DFM Analysis<\/li><li>Hazard Analysis<\/li><li>Tombstone Analysis<\/li><\/ul><\/li><li>Bare Board Analysis (DRC):<ul><li>Minor improvements and bug fixes<\/li><li>New analysis &#8220;Via in Pad&#8221;<\/li><li>New &#8220;Distance to Bord Outline&#8221; analysis for signal and silkscreen layers<\/li><li>New &#8220;Max. Reference Distance&#8221; analysis for silkscreen layers<\/li><li>New analysis &#8220;Via Stubs&#8221;<\/li><li>Improved stub analysis<\/li><\/ul><\/li><li>Component Analysis<ul><li>Completely revised &#8220;Component Distance Analysis&#8221;<ul><li>Body to body distance<\/li><li>Pad to body distance<\/li><li>Pad to pad distance<\/li><li>Distance body to PCB contour<\/li><\/ul><\/li><li>New &#8220;Component Placement Analysis&#8221; to check if the MPN package fits to the CAD package<\/li><\/ul><\/li><li>DFM Analysis<ul><li>Improved &#8220;Selective Soldering&#8221; analysis<\/li><li>Improved &#8220;Panelization&#8221; analysis<ul><li>New &#8220;board to board&#8221; Analysis<\/li><li>New &#8220;component to board&#8221; analysis<\/li><li>New &#8220;component to component&#8221; analysis<\/li><\/ul><\/li><li>New &#8220;Testpoint&#8221; analysis<\/li><li>New &#8220;Solder Paste&#8221; Analysis<\/li><li>New &#8220;Trace under Component&#8221; analysis<\/li><\/ul><\/li><li>Dielectric Strength Analysis<ul><li>New &#8220;Trace under Component&#8221; analysis<\/li><\/ul><\/li><li>Hazard Analysis<ul><li>Bug fixes<\/li><\/ul><\/li><li>Impedance Analysis<ul><li>Bug fixes<\/li><\/ul><\/li><li>Tombstone Analysis<ul><li>Completely redesigned interface<\/li><\/ul><\/li><\/ul><\/li><li><strong>Miscellaneous<\/strong><ul><li>3D View<ul><li>Minor improvements and bug fixes<\/li><li>Step Download from EasyLogix Parts Library (EPL)<\/li><\/ul><\/li><li>Add Components<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><li>BOM Expert<ul><li>New plugin to import the Approved Vendor List (AVL)<\/li><li>Integrated matching with the library (EPL) to get all component information<\/li><li>Support of the EasyLogix Part Library (EPL)<\/li><li>Checking whether the MPN package matches the CAD package<\/li><\/ul><\/li><li>Database Compare<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><li>DFT Preparation:<ul><li>New Spea Export<\/li><li>New options &#8220;Not in BOM&#8221; and &#8220;Omit in Output&#8221; for parts<\/li><li>Test needle optimizer<\/li><li>Netlink function<\/li><li>Many improvements and bug fixes<\/li><li>DFT Session Viewer in PCBI main window<\/li><\/ul><\/li><li>Dimensioning<ul><li>Minor improvements and bug fixes<\/li><li>Advanced API<\/li><li>Possibility of text rotation<\/li><\/ul><\/li><li>Extended Design Report<ul><li>Completely revised<\/li><li>Last result of all analyses can be used (optional: &#8216;critical errors only&#8217;)<\/li><\/ul><\/li><li>Graphic Board Compare<ul><li>Minor bug fixes<\/li><li>Result can be used in the Extended Design Report<\/li><\/ul><\/li><li>Library Manager<ul><li>Improved Part\/Package\/Symbol Library Manager<\/li><li>Support for on-premises\/XML\/365 cloud libraries<\/li><\/ul><\/li><li>Marker List<ul><li>New<\/li><li>Tool to define\/edit markers (fiducials, bad markers, tooling holes)<\/li><\/ul><\/li><li>Panel Builder<ul><li>Minor improvements and bug fixes<\/li><li>Bug fixes for the &#8220;Nesting&#8221; function<\/li><\/ul><\/li><li>Script Engine<ul><li>Minor improvements and bug fixes<\/li><\/ul><\/li><li>Stencil Generator<ul><li>New<\/li><li>Automatic rule-based generation of paste templates<\/li><\/ul><\/li><\/ul><\/li><\/ol>\n\n\n\n<p class=\"wp-block-paragraph\"><em><strong>If there are any questions concerning the latest release, please feel free to contact us.<\/strong><\/em><\/p>\n","protected":false},"excerpt":{"rendered":"<p>As usual, this year&#8217;s release also offers you a wide range of innovations, upgrades and improvements. And because we always focus on you as a customer, all innovations and modifications are geared to your individual wishes.. For us, customer-oriented software development always means maintaining the simplest possible usability, so that you can incorporate all new [&hellip;]<\/p>\n","protected":false},"author":6,"featured_media":1995,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[16,18],"class_list":["post-1852","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-allgemein","tag-pcbi","tag-release","entry","has-media"],"_links":{"self":[{"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/posts\/1852","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/comments?post=1852"}],"version-history":[{"count":5,"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/posts\/1852\/revisions"}],"predecessor-version":[{"id":1892,"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/posts\/1852\/revisions\/1892"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/media\/1995"}],"wp:attachment":[{"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/media?parent=1852"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/categories?post=1852"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sts-development.biz\/en\/wp-json\/wp\/v2\/tags?post=1852"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}